一种新型的EMC接地手段
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| MP4 | N/A | 480P | Download |
| MP4 | N/A | 480P | Download |
| MP4 | N/A | 360P | Download |
| MP4 | N/A | 360P | Download |
| AUDIO | |||
| MP4 | N/A | mp4a.40.2 | Download |
| MP4 | N/A | mp4a.40.5 | Download |
| MP4 | N/A | mp4a.40.2 | Download |
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JPEG | Origin Image | Download |
SMT导电硅橡胶衬垫具有明显优势，适用于PCB任何位置，可通过SMT回流焊接。与常见接地器件相比，SMT导电硅橡胶衬垫具有优异的弹性、回弹性和导电性，能避免金属弹片的缺点，提高EMC性能，是市面上理想的接地手段之一。
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